DeepCool AK620 High Performance Dual Tower CPU Cooler, 6 Copper Heat Pipes, 2x 120 FDB Fans, 260W Heat Dissipation LGA2066/2011-v3/1200/1511/1700
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DeepCool AK620 High Performance Dual Tower CPU Cooler, 6 Copper Heat Pipes, 2x 120 FDB Fans, 260W Heat Dissipation LGA2066/2011-v3/1200/1511/1700

Available: In Stock
  • Product SKU: LS-R-AK620-BKNNMT-G
$132.25
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LGA 1700 Bracket Included

DeepCool AK620 High Performance CPU Cooler equipped with six copper heat pipes stacked with a dense dual-tower fin array and two 120 FDB fans.
Achieve peak performance on your CPU with substantial cooling capacity for high frequency overclocking.
The AK620 features a maximum heat dissipation power of 260W and improved airflow to lower temperatures during demanding system applications.

EXCEPTIONAL COOLING BY DESIGN The AK620 features a precision-machined convex copper base and six copper heat pipes that deliver improved heat transfer capabilities. The dense matrix fin array in a dual tower heat sink layout offers better efficiency for high performance systems.

Application For
Intel LGA 2066/2011-v3/82011/1200/1151/1150/1155/1700
AMD AM5/AM4

Technical Spec
Product Dimensions 129×138×160 mm
Heatsink Dimensions 127×110×157 mm
Net Weight 1456 g
Heatpipe Ø6 mm×6 pcs
Fan Dimensions 120×120×25 mm
Fan Speed 500~1850 RPM±10%
Fan Airflow 68.99 CFM
Fan Air Pressure 2.19 mmAq
Fan Noise ≤28 dB(A)
Fan Connector 4-pin PWM
Bearing Type Fluid Dynamic Bearing
Fan Rated Voltage 12 VDC
Fan Rated Current 0.12 A
Fan Power Consumption 1.44 W
EAN 6933412727316
P/N R-AK620-BKNNMT-G

LGA 1700 Bracket Included

DeepCool AK620 High Performance CPU Cooler equipped with six copper heat pipes stacked with a dense dual-tower fin array and two 120 FDB fans.
Achieve peak performance on your CPU with substantial cooling capacity for high frequency overclocking.
The AK620 features a maximum heat dissipation power of 260W and improved airflow to lower temperatures during demanding system applications.

EXCEPTIONAL COOLING BY DESIGN The AK620 features a precision-machined convex copper base and six copper heat pipes that deliver improved heat transfer capabilities. The dense matrix fin array in a dual tower heat sink layout offers better efficiency for high performance systems.

Application For
Intel LGA 2066/2011-v3/82011/1200/1151/1150/1155/1700
AMD AM5/AM4

Technical Spec
Product Dimensions 129×138×160 mm
Heatsink Dimensions 127×110×157 mm
Net Weight 1456 g
Heatpipe Ø6 mm×6 pcs
Fan Dimensions 120×120×25 mm
Fan Speed 500~1850 RPM±10%
Fan Airflow 68.99 CFM
Fan Air Pressure 2.19 mmAq
Fan Noise ≤28 dB(A)
Fan Connector 4-pin PWM
Bearing Type Fluid Dynamic Bearing
Fan Rated Voltage 12 VDC
Fan Rated Current 0.12 A
Fan Power Consumption 1.44 W
EAN 6933412727316
P/N R-AK620-BKNNMT-G